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Dr. Honghuang Lin, a former graduate student in the Department of Electrical and Computer Engineering at Texas A&M University, received third place for the Best Paper Award at the 29th annual Design and Verification Conference (DVCon) in San Jose, California, this month. Lin also placed third place at 2016 DVCon last year.

Lin, a design verification engineer at Texas Instruments Inc. (TI), along with TI researchers Zhipeng Ye and Asad Khan co-authored the paper, “Machine Learning-Based PVT Space Coverage and Worst Case Exploration in Analog and Mixed-Signal Design Verification.” In the paper they propose a machine learning-based coverage model to achieve more reliable analog and mixed-signal verification with respect to process-voltage-temperature (PVT) variations. Using an adaptive exploration method, the researchers showed that it is possible to reach a more accurate estimation of the worst case PVT configuration with an affordable simulation cost.

More than 750 conference attendees voted on the recipients of the awards for best paper out of numerous submissions, so winning an award for their research paper is considered quite an honor.

“Honghuang joined Texas Instruments in Dallas last year and has played a major role in leading some of the design verification efforts at Texas Instruments since,” said Dr. Peng Li, professor in the electrical and computer engineering department and Lin’s graduate advisor.

Lin received his bachelor’s degree in automation from Tsinghua University, Beijing, China in 2011 and his doctoral degree from Texas A&M in computer engineering in 2016.