Mechanical Engineering graduate student Huaping Xiao's research paper titled “Spatial evolution of friction of a textured wafer surface” was awarded the ‘2013 Best Research Paper’ by the Friction journal in Vol.1, No. 1, 92-97. The other authors of the paper, Ke Wang and Grant Fox are former graduate students from Texas A&M University.
Mechanical failure of integrated circuits and MEMS devices is a major concern. This research demonstrated a new and in situ approach to evaluate friction on a patterned wafer surface. Through measurement of friction, electrical contact resistance, and elemental tracking, the kinetics of material transfer due to a mechanical force have been studied. This research reveals insight into the failure mechanisms of materials of miniature systems and devices that are heterogeneous. It will help semiconductor manufactures to make durable electronic devices that last longer.
Friction is an open access journal, published quarterly by Tsinghua University Press and Springer, and sponsored by the State Key Laboratory of Tribology (Tsinghua University) and the Tribology Institute of Chinese Mechanical Engineering Society. The journal covers all aspects of progress in theoretical and experimental research works related to the friction, lubrication, wear, surface engineering and basic sciences.