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In the electrical and computer engineering department, AI is not a standalone technology or a single course sequence. We’ve designed it to be a horizontal capability that connects theory, hardware, software, systems, and deployment. 

Our department is building an AI ecosystem for ECE: a coordinated set of learning pathways, research opportunities, seminars, industry upskilling, and Capstone experiences designed to ensure AI fluency at multiple levels for every student.

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AI Ecosystem at TAMU

Our AI/ML ecosystem integrates coursework, hands-on learning, research and industry-relevant experiences throughout the student journey as follows:

  1. Foundation: Required sophomore AI course establishes shared language, core models, and responsible practice.
  2. Integration: AI is embedded across ECE subareas, not one-size-fits-all. 
  3. Practice & Impact: Short sprint courses, research pathways, and AI capstone projects translate fluency into real outcomes.
AI Ecosystem infographic

What the Ecosystem Enables

  • AI fluency for every student, from fundamentals to application and deployment. 
  • AI across the stack with methods grounded in ECE context (data, signals, physics, systems).
  • Research immersion for junior research scholars, lab opportunities and depth in graduate studies.
  • Continuous upskilling from industry-aligned short courses, sprint courses, and workshops. 
  • Presenting AI as a hands-on tool, not just as a topic. 
  • Using templates, compute pathways and reproducible practices to increase research productivity.
  • A community of engineers, hackers, scholars, and opportunities for collaboration.

Student Success

 

Fidel Omusilibwa

A recent project Fidel worked on, SenseEdge, was recently selected as a winning entry in the ChipFoundry ASIC Design Challenge.

SenseEdge is an edge AI ASIC for predictive maintenance that integrates machine learning for real-time machine health monitoring and fault classification directly in hardware. As a winner, the project receives a fully sponsored tapeout, packaging, and PCB development support through GlobalFoundries using the open-source SKY130 PDK.

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LLM Projects